Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed ...

OpenAI is developing its own AI accelerator using Broadcom. Anthropic is also rumored to be exploring doing its own chip. As the developers of the most popular frontier models, one can expect they’ll ...

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Today’s most advanced AI systems rely on larger, more complex assemblies of dies and chiplets from multiple process nodes and foundries, driving unprecedented demands on advanced packaging. At the ...

Implementing the Cyber Resilience Act: Practical Guidance for Security Engineering and Compliance is a practical eBook designed to help product manufacturers, security teams, compliance leaders, and ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

AI integration is accelerating aging in automotive sensors and other components. AI-powered systems must be built through meticulous, advanced model testing, but they also must adapt to future AI ...